Low-pressure sealing molding (hot melt molding) technology
Epoxy resin and polyurethane resin potting alternatives. Low-pressure molding (LPM) using plant-based hot melt. Towards lightweight, high functionality, and high efficiency.
Bostik Nitta Co., Ltd. handles plant-based thermoplastic hot melt polyamide (HMPA). We can provide proposals from the initial consideration of materials and equipment to prototyping and mass production. Please feel free to contact us for more details. Our products have heat resistance up to 150°C and high adhesion strength, and are utilized for fixing and sealing waterproofing of electronic components such as substrates and sensors through low-pressure injection molding. Furthermore, low-pressure injection molding (LPM) technology plays an important role not only in sealing, filling, and fixing electronic components (automotive, electrical and electronic industries) but also in protecting products from dust, dirt, heat, and moisture. Hot melt does not require curing and contributes to improved production efficiency. 【Features】 ■ Improved production efficiency (reduced man-hours and time) ■ High design flexibility ■ Reduced material and equipment costs ■ High heat and environmental resistance ■ High functionality and adhesion strength ■ Sustainable and reusable *You can download the catalog.
- Company：ボスティック・ニッタ
- Price：Other
